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Application of heat shrinkable casing on the main board of circuit

Author: ComeFrom: Date:2018/1/18 9:49:03 Hits:1581
The main functions of heat shrinkable bushing are electrical insulation, solder joint corrosion protection, mechanical protection and wire harness protection. It is widely used in the fields of electronics, communications, machinery and automobile manufacturing. Today, Xiaobian introduces the application of heat shrinkable tube on the circuit motherboard.
The familiar motherboard is composed of many card slots, plug-ins, chips and other wiring harness. There are solder joints and branching bifurcations between wire harness and card slot, so it is necessary to use heat shrinkable tube to protect solder joints.
The main function of the heat shrinkable tube on the main board of the circuit has the following points:
The 1. solder joints are sealed and antirust, and the heat shrinkable tube can effectively reduce the oxidation and corrosion of the solder joints.
2. insulation and short circuit protection; the heat shrinkable tube can effectively prevent the short circuit of the electric plate from the overlap of foreign objects.
The 3. door wire harness branch; slot in the main circuit board in a large wire will be divided into several small bundles respectively at the interface of lap, wire harness crotch can effectively protect the heat shrinkable tube, fixed fork is no longer due to external factors and diffusion;
4., extend the service life of the electric board; the main board of the circuit, such as the computer motherboard and the large machine motherboard, run at a higher temperature. The heat shrinkable tube can effectively reduce the aging rate of the wire harness, protect the wiring harness from being eroded by the dust, and prolong the service life of the electric board.
5., the role of marking; heat shrinkable tubes after printing and using different color heat shrinkable tubes, can be used to mark the use of no wiring harness, facilitate identification and later maintenance.
Next:The influence of heat shrinkable time on heat shrinkable casing
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